On October 2, Samsung Electronics was reported to have offered HBM4, its next-generation high-bandwidth memory (HBM), at a mid-to-high $4 per gigabit (Gb) in negotiations for annual supply contracts covering 2027. The reported comparison put HBM3E at around $1.50 per Gb.
The offer was part of ongoing negotiations
Price talks were still underway on October 2 and were expected to approach their final stages during October. Negotiations for a substantial share of next year's major HBM volumes had already concluded.
Samsung's stated HBM4 specifications
Samsung lists HBM4 with a data-transfer speed of 11.7 Gbps, bandwidth of 3.3 TB/s and 2,048 I/O pins. Its specifications also describe a 12-high stack with up to 36 GB. Data-transfer speed and bandwidth measure different things: the first is a per-pin rate, while the second describes the volume of data the memory can move over time.
Samsung also claims 40% better energy efficiency and 30% improved heat dissipation compared with HBM3E.
TrendForce forecast HBM average selling prices would rise 121% in 2027 compared with 2026, citing a larger HBM4 share and supply constraints.
