Huawei and Qualcomm announce a multiyear patent agreement

The deal covers 5G, computing, AI and networking; Qualcomm will also purchase certain Huawei U.S. patents.

October 5, 2026

Huawei and Qualcomm announce a multiyear patent agreement

Key points

01
Huawei and Qualcomm announce a multiyear patent cross-license on October 5, 2026.
02
The reciprocal licenses cover 5G, computing, AI and networking.
03
Qualcomm will purchase certain Huawei U.S. patents in computing, AI, networking and other technology areas.
04
The LogicFolding connection is reported, and the announced closing condition is necessary regulatory approvals.

Huawei and Qualcomm announce a patent deal across 5G, computing, AI and networking, plus a planned purchase of certain Huawei U.S. patents.

Huawei and Qualcomm announce a multiyear patent cross-license on October 5, 2026, covering 5G, computing, AI and networking. The agreement also includes Qualcomm’s planned purchase of certain Huawei U.S. patents.

What the agreement covers

The companies’ cross-license covers their patent portfolios in 5G, computing, AI and networking. Separately, Qualcomm will purchase certain Huawei U.S. patents in computing, AI, networking and other technology areas.

The reported LogicFolding connection

Qualcomm’s license reportedly includes patents underlying Huawei’s LogicFolding chipmaking technique. LogicFolding is a chip design approach; hybrid bonding is a physical interconnect or packaging technique. The two are related, but not the same.