Broadcom and a group of lenders are reportedly organizing an approximately $60 billion debt package for AI chips and infrastructure intended for Anthropic and other companies. Accounts published on October 2, 2026, described a $42 billion senior-secured tranche and an $18 billion junior tranche, with syndication underway.

How the proposed $60 billion package is structured

The reported package has two tranches: $42 billion in senior-secured Class A debt and $18 billion in junior Class B debt. Senior-secured debt is backed by collateral and ranks ahead of junior debt for repayment. Syndication means distributing portions of a financing among multiple lenders.

Blackstone is reportedly leading the junior tranche. It was also expected to contribute $9 billion from several funds, with the remainder of its $18 billion tranche to be syndicated.

Reported structure and scope of the financing.

Financing instrumentReported amountStructure and intended scope
Proposed packageAbout $60 billionDebt for AI chips and infrastructure intended for Anthropic and other companies
Class A tranche$42 billionProposed senior-secured portion of the package
Class B tranche$18 billionProposed junior portion, reportedly led by Blackstone
Separate Anthropic facilityUp to $42 billionReported credit facility for Anthropic’s infrastructure spending and chip leasing

The separate Anthropic facility of up to $42 billion

Broadcom was separately reported to have agreed to provide Anthropic with a credit facility of up to $42 billion for infrastructure spending and chip leasing. That facility is distinct from the proposed $42 billion senior tranche, which is one part of the wider package for multiple companies. NeoTeo’s earlier coverage of Broadcom’s separate facility for Anthropic covers that arrangement.

Who the package is intended to support

The approximately $60 billion package is intended to support AI chips and infrastructure for Anthropic and other companies. Anthropic is one of the reported beneficiaries, alongside other firms.