MediaTek plans to bring former Intel executive Navid Shahriari on as a senior vice president on November 9, 2026, according to a November 4 report by Liberty Times. His expected remit spans advanced processes, packaging, testing, quality and reliability, areas tied to the company’s push into AI computing.
What Shahriari is expected to oversee
Liberty Times reported that Shahriari would lead work on advanced-process and yield platforms, design-technology co-optimization, advanced testing and packaging, and quality and reliability. Design-technology co-optimization means coordinating chip design with the manufacturing process used to produce it.
That portfolio brings several stages of chip development under one senior role, from process and yield work through packaging and reliability. The focus fits MediaTek’s reported effort to expand its data-center and AI-computing business.
The reported remit links chip-process engineering with packaging, testing and reliability.
His 37 years at Intel
Liberty Times reported that Shahriari retired from Intel in June 2026 after 37 years there. His previous responsibilities included back-end operations, packaging and testing, advanced-packaging strategy, chiplet integration and test technology. Chiplets are separate pieces of silicon designed to work together within a larger processor.
Those areas overlap with the responsibilities he is expected to take on at MediaTek, particularly advanced packaging and testing.
MediaTek’s packaging options
In May 2026, Reuters reported that MediaTek supports both Intel’s EMIB and TSMC’s CoWoS advanced-packaging approaches, with customers able to choose between them. Reuters also reported that former TSMC research and development vice president Douglas Yu joined MediaTek as a part-time adviser focused on advanced packaging and roadmap planning.
The reported appointment of Shahriari adds another senior role focused on packaging to that broader effort. MediaTek’s reported support for EMIB and CoWoS gives customers a choice between the two approaches.
