nVent and AMD are collaborating on a dual rear-door heat exchanger for AMD Helios, a rack-scale AI platform. The DC-powered design is made to span Helios’s double-wide rack, capture heat left after direct-to-chip liquid cooling and return cooled air to the room, according to nVent’s product description.
A paired system for a double-wide rack
A conventional rear-door heat exchanger serves one rack, nVent says. For AMD Helios, the company describes two rear doors engineered to work together as one system across the double-wide rack. The distinction is architectural: this design spans the wider rack rather than treating each side as a separate, single-rack installation.
nVent describes the cooling system as part of the Helios platform, alongside AMD Instinct GPUs, EPYC CPUs, Pensando networking and AMD ROCm software. MarketScreener reported on October 13, 2026, that nVent and AMD planned a preview of the exchanger at the Open Compute Project Global Summit in San Jose.
How the exchanger handles residual heat
Direct-to-chip liquid cooling removes heat at the processors, while nVent says its rear-door exchanger captures heat left over and sends cooled air back into the room. The company’s design description presents the two doors as a single cooling system across the rack.
What nVent means by room-neutral cooling
nVent uses “room-neutral” to describe returning cooled air instead of releasing the rack’s heat into the room. The company says this means additional room or perimeter cooling is not needed.
AMD Helios and AMD Helion are separate rack designs
The nVent cooling collaboration is for AMD Helios. AMD Helion is a separate rack blueprint described as drawing on Helios’s open-platform approach, as Investing.com reported. NeoTeo has also covered AMD Helion’s two rack designs.
