Commercial Times reported on Oct. 27, 2026, that unnamed supply-chain and chip-industry sources described a possible 10%–20% increase in TSMC CoWoS quotations, with the adjustment reaching as much as 20%. Wccftech said the same day that TSMC had not confirmed the proposal.
CoWoS is TSMC’s advanced-packaging service. The reported percentage applies to its service quotations.
Demand is putting pressure on packaging and testing
Commercial Times linked the reported pricing pressure to demand that has spread from AI GPUs to server CPUs and custom ASICs. The report also said longer testing for AI chips is putting pressure on packaging and testing capacity. Equipment deliveries can take as long as eight months, it said.
Customers are prioritizing delivery schedules
Commercial Times reported that customers were placing orders with suppliers able to meet delivery schedules rather than spending time bargaining over price.
