TSMC is reportedly targeting monthly capacity of 120,000 wafers for its N2 process family by the end of 2026. The figure is a forward-looking goal, not a measure of current output.
TSMC’s reported N2 capacity target
The 120,000-wafer figure concerns TSMC’s N2 process family, the company’s generation identified as “2 nm.” Here, capacity means planned monthly wafer throughput for that process family; it is distinct from TSMC’s combined output across its manufacturing generations.
How the target compares with earlier estimates
An earlier estimate for N2 capacity at the end of 2026 was about 90,000–100,000 wafers per month. Estimates for 2027 had ranged from 110,000 to 140,000 per month. Those figures refer to different forecast periods: the reported 120,000 target brings a number previously associated with 2027 into the year-end 2026 goal.
The reported fab ramp and longer-term projections
TSMC senior vice president and co-COO Y.H. (Kevin) Hou was reported to have outlined a 2026 volume ramp across five N2 fabs: two in Hsinchu and three in Kaohsiung.
Hou was also reported to project that N2 capacity would grow at a 70% compound annual growth rate from 2026 through 2028. He was further reported to expect first-year N2 wafer output to be 45% higher than first-year 3 nm output. Both figures are projections, not measurements of achieved capacity or output.
