ChangXin Memory Technologies (CXMT) reportedly allocated CNY 22.4 billion to equipment procurement within a CNY 24.1 billion research-and-development budget. The equipment spending is part of a wider CNY 34.9 billion plan that CXMT’s board reportedly approved on September 28, 2026. This adds detail to NeoTeo’s earlier coverage of the reported CNY 34.9 billion plan.
How CXMT’s reported investment is allocated
The plan’s two main projects are new technology R&D and phase two of a wafer-testing base. Equipment procurement is nested within the R&D allocation, not an additional project amount.
| Investment item | Reported amount | Relationship within the plan |
| Total investment plan | CNY 34.9 billion | Combined reported allocations |
| New technology R&D | CNY 24.1 billion | One of the two main project allocations |
| Equipment procurement | CNY 22.4 billion | Included within the R&D allocation; about 93% of it |
| Phase two of wafer-testing base | CNY 10.8 billion | The other main project allocation |
A substantial share of the equipment orders is expected to go to Chinese suppliers. That expectation concerns the orders tied to the plan.
Wafer starts and saleable DRAM
A reported estimate puts CXMT’s DRAM capacity at 300,000–320,000 wafer starts per month. The market expectation reported for 2027 is 420,000 per month.
A wafer start counts a wafer entering production. The amount of saleable DRAM depends on factors including yield, die density, product mix, packaging and customer qualification.
