On October 28, 2026, reports citing Reuters said unnamed sources described ChangXin Memory Technologies (CXMT) as having sent HBM3E samples to several domestic AI-chip designers and targeting limited production within two months of that date. The reports describe a production plan, alongside sample testing.
CXMT’s reported plan covers samples and limited production
CXMT reportedly supplied two sample designs: a standard version and a revision intended to improve manufacturing yield. The reports put the effort in the context of HBM development that CXMT reportedly began as early as 2024.
What the yield estimates measure
Manufacturing yield is the share of units that meet specifications. Anonymous sources cited in the reports estimated CXMT’s HBM3E yield at 20% to 30% and SK hynix’s at about 70%. Yield describes the portion of manufacturing output that meets specifications; it is not a memory-speed measure. A low yield can raise the cost of usable output when units need rework or are discarded.
What the performance comparison says
The reported testing placed CXMT’s HBM3E closer in performance to SK hynix’s HBM3 than to its HBM3E. That is a qualitative comparison, not a numerical benchmark.
For chip designers, evaluating samples and qualifying a component for use in a product are distinct steps. The reports describe sample shipments and testing, followed by a forecast for limited production.
