Micron is expanding manufacturing across four sites in Taiwan, with a second advanced-packaging facility for high-bandwidth memory (HBM) in Taichung. The other projects cover dynamic random-access memory (DRAM), front-end manufacturing and wafer testing.
Micron Memory Taiwan chairman Donghui Lu said the company is scaling manufacturing across the four sites. The projects differ by location and function:
What each Taiwan site is set to do
| Site | Project | Reported work |
| Taichung, Houli Science Park | Second advanced-packaging facility | HBM |
| Taoyuan, Fab 11E | Advanced DRAM facility | DRAM production designed for extreme ultraviolet (EUV) lithography |
| Tongluo, Miaoli County (P5) | Expansion of the P5 site and construction of a second facility | Front-end manufacturing |
| Tainan | Conversion of a former display-panel site | Primarily front-end wafer testing |
In Taichung, Micron began converting an existing facility into its second advanced-packaging plant in 2025. At Tongluo, Micron acquired the P5 fab from Powerchip Semiconductor Manufacturing Corporation (PSMC) earlier in 2026. More than 100 pieces of equipment had moved into the site, and a second facility was under construction.
At Tainan, equipment began moving into the converted semiconductor site in early September 2026. The work there is focused mainly on front-end wafer testing.
Project timelines and memory supply
Micron targeted the first production phase at Tongluo for the second half of 2027. Taoyuan Fab 11E was slated to begin operating in late 2027 or early 2028.
Micron expected memory supply constraints to be more severe in 2027 and 2028 than in 2026. The outlook came during the company’s fiscal 2026 fourth-quarter earnings call on September 30, 2026. NeoTeo covered the results in its report on Micron’s fiscal Q4 2026. For a separate view of the broader supply outlook, see NeoTeo’s coverage of Intel’s warning about memory shortages in 2027.
Micron’s reported Taiwan investment
Lu said Micron’s accumulated investment in Taiwan reached NT$1.6 trillion (US$50.2 billion) as of June 2026.
