Accounts of Reuters’ October 28, 2026, reporting said ChangXin Memory Technologies (CXMT) planned to begin limited HBM3E production within two months. The reported yield estimate was 20%–30%. The accounts attributed the plan to sources familiar with the matter.
What the yield estimate means
Yield is the share of chips that meet specifications after production. The reported 20%–30% figure is an estimate for CXMT’s HBM3E, not a published benchmark result.
Samples and possible market timing
CXMT reportedly sent two sample designs to several domestic AI-chip designers: a standard version and a modified version intended to improve yield. The designers were not named. A source cited in Reuters’ reporting described test performance as closer to SK hynix’s older HBM3 than to HBM3E.
Products using CXMT memory could reach the market as early as 2027, according to an account of the reporting. That is a possible market arrival, separate from the reported plan for limited production.
A separate HBM4 market outlook
In a separate report published October 28, FomoEra said SK hynix expected HBM4 to exceed HBM3E in both shipments and revenue during the fourth quarter of 2026.
