Bits&Chips reported on October 19, 2026, that Terafab was expected to receive its first ASML extreme ultraviolet (EUV) lithography system in mid-2027. The forecast is attributed to journalist Tim Culpan, who cited unnamed sources.
Austin’s research fab has a separate installation timeline
Bits&Chips reported that the scanner could reach Terafab’s research fab near Austin before the facility was ready to accommodate it. Tom’s Hardware reported an estimate of 15 months from the start of construction to complete the building, followed by a further six months for equipment installation and setup before wafer-processing experiments could begin.
Those are separate stages in the reported Austin schedule: a possible equipment arrival, a building ready to receive it, and setup before experiments. They do not place the scanner into use as soon as it arrives.
Grimes County is a separate volume-production site
The planned Grimes County site is distinct from the Austin research fab. A separate Terafab question concerns possible cooperation with TSMC; NeoTeo previously covered the reported talks.
Tesla’s March 21, 2026 announcement described TERAFAB as a planned project with SpaceX and xAI and stated a target of 1 TW of chip production per year.
For the separate Grimes County site, Bits&Chips relayed SemiAnalysis forecasts that its first phase would begin operating in late 2029 and volume production would start by mid-2030. Bits&Chips also reported Intel 14A as the planned process for that site.
