ETNews reported on Oct. 21, 2026, that SK hynix had contacted domestic and international materials, parts and equipment suppliers about applying its integrated-cooling iHBM design and preparing for possible mass production. The discussions focus on adapting the design to manufacturing processes and assessing production plans.
How iHBM is designed to move heat
ETNews reported that SK hynix unveiled iHBM in May 2026. Its Integrated Cooling Elements (ICE) are positioned in the HBM base die’s physical-connection region, where they are intended to create another path for heat to move away from the memory.
What the thermal-resistance claim measures
ETNews attributes to SK hynix a claim that iHBM can reduce thermal resistance by more than 30%. Thermal resistance describes how strongly a material or structure impedes heat flow. The reported percentage concerns that resistance, not the amount of heat generated or electricity consumed.
Manufacturing approach and HBM5 target
ETNews described a planned approach using advanced MR-MUF and wafer-level packaging (WLP), with the aim of working within the existing HBM supply-chain framework. It also reported that SK hynix was validating HBM5 using TSMC’s CoWoS advanced packaging.
ETNews identified HBM5 as the target generation for iHBM and placed HBM5 on a 2029 roadmap horizon. That is the reported timing for the generation’s roadmap, not a stated iHBM availability date.
